Finetech | Berlin is a leading provider of precision die-bonders, offering advanced placement, assembly, and rework systems. They recently announced the purchase of the FINEPLACER® sigma system by their long-established customer, Promex. This marks the second Finetech system acquired by Promex, following their purchase of the FINEPLACER® pico system in 2019.

The new FINEPLACER® sigma system will enable Promex to expand their manufacturing capabilities in various industries, including automotive, biotech, medical, and optical. The FINEPLACER® sigma system is designed to deliver high placement accuracy for processes like flip chip, wafer-level packaging, package stacking, and chip-on-glass/flex/board. With its modular design, the system offers valuable flexibility, allowing modules to be easily combined or exchanged for different projects.

It features sub-micron placement accuracy, a large working area, and bonding forces up to 1000 N. Additionally, it offers various key technologies, including sintering, thermocompression bonding, ultrasonic bonding, eutectic soldering, adhesive bonding, and precision vacuum die bonding. The system also incorporates the FPXVision™ vision alignment system, which allows for precise placement of small devices on large substrates.

Finetech is excited to continue their partnership with Promex and provide them with the advanced capabilities of the FINEPLACER® sigma system. This latest addition to Promex's die-bonding service will enhance their ability to meet the demands of their customers' precision bonding requirements