Interconnect Systems, a subsidiary of Molex, specializes in providing microelectronics packaging, device design, and manufacturing solutions for a range of industries including aerospace, defense, and industrial applications. With a strong emphasis on complex development projects, they excel in tight integration among various microelectronic disciplines. Their in-house design, manufacturing, and test capabilities allow them to quickly deliver prototypes and production volumes.

The highly experienced PCB and substrate design team at ISI utilizes the latest tools, materials, and techniques to provide state-of-the-art designs in both analog and digital realms. ISI also offers comprehensive capabilities for ruggedizing microelectronic assemblies for high-reliability applications, integrating complex, multiple-component assemblies into a single module. Their overmolded modules are designed to withstand extreme conditions encountered during manufacturing processes.

From capturing customer requirements to detailed design and manufacturing process development, ISI employs a collaborative co-development process to ensure timely delivery. They also prioritize thorough production and qualification testing to meet customer specifications. Contact ISI, the experts in microelectronics, for all your packaging, design, and manufacturing needs