Kelvin Thermal Technologies, Inc. Our founders, renowned experts in mechanical engineering, have played a pivotal role in the development of ultra-thin and highly efficient Thermal Ground Planes (TGP), such as vapor chambers and 2-D flat heat pipes. Having been involved in a major DARPA project from 2008 to 2013, our founders acquired extensive knowledge and technology in TGP.

With an exclusive partnership with the University of Colorado Boulder, we have secured a valuable portfolio of Intellectual Property (IP). This led to the establishment of Kelvin Thermal Technologies, Inc. Since our inception, we have continuously enhanced our IPs, manufacturing processes, and business activities.

We are proud to announce that our first mass-produced TGP product will be available through one of our trusted manufacturing partners by January 2021. At Kelvin Thermal, we cater to a wide range of customers and applications. Our advanced thermal management solutions find applications in various industries, including microelectronics, microwave technology, optics, and MEMS/NEMS devices