@statschippac.com
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication.
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STATS ChipPAC, headquartered in Singapore, is a leading provider of advanced semiconductor packaging and test services. The company has a rich history that spans over 30 years. Established in 1994, the company quickly gained prominence in the industry and became a subsidiary of the now-defunct Singapore Technologies Group.
Over the years, STATS ChipPAC expanded its operations and established itself as a key player in the global semiconductor packaging and test industry. STATS ChipPACβs headquarters is located in Ang Mo Kio, Singapore. This state-of-the-art facility serves as the main center for research, development, and innovation.
The headquarters houses advanced laboratories, manufacturing lines, and a dedicated workforce of skilled engineers and technicians. The company's commitment to technological advancements and high-quality solutions is reflected in its world-class headquarters. As a leading provider of semiconductor packaging and test services, STATS ChipPAC offers a wide range of products and services.
These include advanced packaging, fan-out wafer-level packaging, wafer-level chip scale packaging, flip chip packaging, and system-in-package solutions. The company also provides test services such as wafer sorting and final testing. STATS ChipPAC's products and services cater to various industries, including automotive, consumer electronics, telecommunications, and medical.
On a global scale, STATS ChipPAC operates through a network of advanced manufacturing facilities and offices in Singapore, South Korea, China, and Malaysia. The company has established partnerships, joint ventures, and subsidiaries with key industry players, enhancing its global presence. STATS ChipPAC collaborated with Amkor Technology, a leading provider of semiconductor packaging and test services, to form a strategic alliance called the ACP Alliance.
This joint venture focuses on developing advanced flip chip and wafer-level packaging solutions for customers worldwide. Ranked among the top players in the global semiconductor packaging and test market, STATS ChipPAC holds a strong market position and maintains healthy competition with industry rivals. Its focus on innovation, customer-centric approach, and strong strategic alliances have contributed to its success.
With a significant market share, STATS ChipPAC consistently delivers on customer expectations and maintains a competitive edge. In terms of major events, STATS ChipPAC was acquired by Jiangsu Changjiang Electronics Technology Co. Ltd.
(JCET), a leading Chinese semiconductor packaging and test company, in 2015. This acquisition expanded JCET's global presence and allowed STATS ChipPAC to leverage JCET's extensive resources and expertise. Currently, STATS ChipPAC continues to thrive as a key player in the semiconductor packaging and test industry.
The company consistently adapts to market demands and invests in cutting-edge technology. Its commitment to innovation and customer satisfaction ensures ongoing growth and success in the highly competitive semiconductor industry
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