3D InCites is a brand that stirs up interest in heterogeneous integration by following the latest developments in 3D IC technologies and 3D packaging. Their focus is particularly on 3D TSVs, providing comprehensive coverage of 3D IC technology and heterogeneous integration. Through their website, 3D InCites offers a wide range of products and services to cater to the needs of the semiconductor industry.

They provide information and insights on 3D integration, including design, devices, manufacturing, materials, processes, and technology. They also offer news updates, job listings, white papers, book reviews, and blogs from industry experts like Francoise in 3D Packaging and IFTLE. Additionally, 3D InCites hosts events, such as the 2023 3D InCites Awards, and provides event coverage, including conferences, webinars, and community member previews.

Their brand aims to be the go-to resource for all things related to 3D IC technologies and heterogeneous integration