FlipChip is a leading brand in the semiconductor industry, offering a wide range of innovative products and services. With a state-of-the-art facility in Phoenix, Arizona, FlipChip is known for its commitment to leadership and quality in wafer bumping solutions. Their facility features a class 1000 clean room, providing the ideal environment for their cutting-edge technology development.

FlipChip's extensive product lineup includes wafer bumping options, wafer level packaging, embedded die packaging, and chip scale packages. They also offer services such as design, test, and die sales. FlipChip has a strong history of collaboration and strategic partnerships, having worked with industry giants like Microchip Technology Incorporated and Semiconductor Manufacturing International Corporation.

As a testament to their expertise, many of the industry's top players have licensed and implemented FlipChip's bumping technology. With a focus on innovation, FlipChip remains at the forefront of developing and bringing to market the latest bumping technology. Trust FlipChip to deliver high-quality solutions that meet the evolving needs of the semiconductor industry