PacTech is a leading supplier of Advanced Packaging Equipment and Wafer Level Bumping & Packaging Services, catering to customers around the globe. They offer a wide range of cutting-edge equipment and services designed to meet the needs of various industries, including Aerospace, Automotive, Consumer Electronics, Energy and Solar, Medical, and Production and Assembly. For Advanced Packaging Equipment, PacTech provides revolutionary solutions for automated and high-precision manufacturing.

Their lineup of equipment includes laser soldering, laser-assisted bonding, electroless plating, solder ball mounting, and wire soldering. These technologies ensure efficient and reliable packaging processes. In addition to equipment, PacTech also offers highly customized Wafer Level Packaging services.

These services include electroplating, electroless plating, laser-assisted bonding, solder balling, wafer level component assembly, wafer thinning, wafer metal coating, and wafer dicing. With their expertise in these areas, PacTech can deliver top-quality packaging solutions that meet the unique requirements of their clients. With PacTech, customers can expect state-of-the-art equipment, advanced packaging techniques, and exceptional customer service.

They are committed to excellence and innovation in the field of advanced packaging, making them a trusted partner for businesses across industries