錸德 | Hsinchu is a renowned company based in China that specializes in the design, development, and production of advanced semiconductor packaging materials and equipment. The company was founded in 1995 and has since established itself as a leading provider of innovative solutions for the semiconductor industry. 錸德 | Hsinchu’s headquarters are located in Hsinchu City, Taiwan.

This strategic location enables the company to tap into the rich resources and expertise available in Taiwan's semiconductor hub. With a strong focus on research and development, the company has a dedicated team of engineers and scientists who continuously strive to push the boundaries of semiconductor packaging technology. The main products offered by 錸德 | Hsinchu include a wide range of advanced packaging materials such as leadframes, substrates, bonding wires, and thermal management solutions.

Additionally, the company provides cutting-edge equipment for manufacturing processes like wire bonding, die attach, and encapsulation. These products and services are crucial in enabling semiconductor manufacturers to package their chips efficiently and to meet the ever-increasing demands of the industry. In terms of its global operations, 錸德 | Hsinchu has established a strong presence in key semiconductor manufacturing regions, including China, Taiwan, South Korea, and Southeast Asia.

The company has also expanded its footprint through various subsidiaries, joint ventures, and partnerships. Notably, it has collaborated with leading semiconductor companies and equipment manufacturers to jointly develop and market innovative solutions. With its relentless focus on innovation and commitment to quality, 錸德 | Hsinchu has achieved a prominent market position in the semiconductor packaging industry.

The company's global sales and revenue have witnessed steady growth over the years, enabling it to stand out amidst fierce competition. It is known for its customer-centric approach, providing tailored solutions to meet the specific requirements of its clients. Significant milestones in the company's history include the development of advanced packaging materials that enable higher performance and improved thermal management in semiconductor devices.

This has strengthened its position as a trusted partner for leading chip manufacturers. As of the latest available information, 錸德 | Hsinchu continues to thrive in the semiconductor industry. With its cutting-edge technology, extensive product portfolio, and global presence, the company remains well-positioned for future growth and success