ACM Research is a leading global equipment manufacturer specializing in innovative solutions for the IC, compound semi, wafer-level packaging, and wafer manufacturing industries. Our Smart Megasonix™ technologies offer advanced cleaning for IC and 2D/3D devices without causing damage. From wet processing to stress-free polishing, we provide cutting-edge tools and processes to optimize semiconductor manufacturing.

Our proprietary technologies like SAPS™, TEBO™, and Ultra SFP ap cater to specific needs, ensuring efficient and damage-free cleaning for patterned wafers, high-aspect-ratio structures, and advanced packaging applications. We also offer eco-friendly solutions like the Ultra C Tahoe cleaning system.

At ACM Research, we are committed to constant innovation to support the development of the most advanced microelectronic devices. Partner with us for comprehensive support and access to industry-leading technologies that enable your innovations to thrive. Contact us today to explore customized solutions for your specific requirements.