Chiplet Summit

Chiplet Summit is a conference and exhibition focused on the technologies, partnerships, and practical approaches involved in developing chiplets. Its event brings together industry leaders, experts, sponsors, exhibitors, and attendees to explore solutions across the chiplet ecosystem. The 2027 Chiplet Summit is scheduled for March 30 through April 1 at the Santa Clara Convention Center, with registration and opportunities to participate as a sponsor or exhibitor available through the event website.

The summit’s program includes keynote addresses, special presentations, expert discussions, awards, and exhibits. Recent keynote speakers and participating organizations have included Synopsys, Alphawave Semi, Siemens, the UCIe Consortium, Cadence, Arm, the Open Compute Project, and Marvell. Topics featured in the 2026 program included AI and machine-learning acceleration, the open chiplet economy, advanced packaging methods, die-to-die interfaces, and collaboration with foundries. Chiplet Summit also provides resources for speakers, sponsors, exhibitors, and attendees, along with conference proceedings, travel information, and an archive of past events.