Eliyan is a pioneering brand in the field of chiplet systems, offering cutting-edge technology and innovative solutions. With their Ultimate Chiplet Interconnect, they provide high-performance chiplet systems at a fraction of the total cost of ownership compared to advanced packaging. By utilizing standard organic chip packaging, Eliyan achieves higher numbers of cores, improved compute performance, superior test coverage, and increased yield.

They have developed NuLink™, an exclusive interconnect solution that delivers unmatched performance and power/area efficiency. With twice the bandwidth and half the power of other technologies, Eliyan's NuLink™ solution stands out in the industry. Eliyan's chiplet interconnect technology is set to revolutionize the industry by making multi-die approaches more appealing to chip suppliers.

Their technology optimizes power and bandwidth vectors, making it ideal for accelerated server computing applications. The brand has gained industry recognition and support, with their breakthrough Die-to-Die Interconnect, Bunch of Wires (BoW), being adopted by the Open Compute Project (OCP) on organic substrates and advanced packaging. Eliyan's experienced team, led by CEO Ramin Farjadrad and including renowned experts, has more than 30 years of experience in building enterprise and server class chips.

With a focus on innovation, Eliyan is leading the way in chiplet technology and providing efficient solutions for the multi-die era