Engis Corp, also known as 日本エンギス株式会社, is a leading brand that specializes in the development of ultra-precision polishing and grinding technologies using advanced abrasive materials. Since its establishment in 1983 in Yokohama, Japan, Engis Corp has been dedicated to the development of precision processing techniques using ultra-abrasive grains. Engis Corp offers a wide range of high-quality products and services in various industries, including power electronics, fine ceramics, magnetic recording heads, semiconductor manufacturing components, communication devices, and precision molds.

Their product portfolio includes diamond powders, PCD & PCBN, lapping and polishing machines, diamond slurries, grinding machines, bonding machines, and much more. With over 85 years of history, Engis Corp combines their unique HYPREZ® ultra-abrasive grinding agents with customizable grinding equipment to create efficient and stable processes tailored to their customers' needs. Their mission is to lead the next generation of technology with ultra-abrasive materials and continue to contribute to the development of a prosperous and sustainable society.

Engis Corp values integrity, professionalism, respect, and teamwork, ensuring they provide the highest level of service and build long-term relationships with their customers. For more information and to explore their catalog, visit their website at http://www. engis.

co. jp/