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Revolutionary Copper MIMO technology eliminates costly HBM chips. 10X lower cost, 3X lower power, 8X more scale for next-gen AI systems and connectivity.
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Kandou.ai develops high-performance interconnect technology for AI infrastructure, combining insights from information theory and semiconductor design to improve how data moves across copper links. Its Copper MIMO approach, using Chord Signaling, harnesses interference and noise in copper channels rather than treating them solely as obstacles. The company says this technology can deliver more than 10 times lower cost, three times lower power, and eight times more scale, with the aim of reshaping the economics of next-generation AI systems.
Kandou’s work addresses connectivity for AI inference, CXL memory platforms, and high-speed scale-up and scale-out networking. Its offerings include GPU connectivity using next-generation 448G and beyond copper links, and chip-to-chip links for efficiently scaling processor memory subsystems. The product portfolio also features Matterhorn, a USB4 retimer; Regli, a low-latency, compliant PCIe retimer; Zetti, a PCIe Gen 5 switch for multi-peripheral devices; and Glasswing, chiplet interconnect IP based on CNRZ-5 Chord Signaling. Together, these products support faster, more energy-efficient connections across computing devices and systems.
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Computers Electronics and Technology
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