RENA Technologies North America

RENA Technologies develops wet process solutions and manufacturing equipment for semiconductor production. With more than 30 years of experience, the company serves front-end-of-line and back-end-of-line applications through established platforms and customized systems. Its equipment supports wafer sizes from 150 mm to 300 mm and processes materials including silicon, silicon carbide, gallium nitride, gallium arsenide, and indium phosphide. These technologies are used in the fabrication of integrated circuits, MEMS sensors, photonic devices, RF components, and power electronics.

RENA’s semiconductor portfolio includes manual, semi-automated, and fully automated batch immersion systems; batch spray tools; single-wafer processing platforms; prime wafer processing equipment; electroplating systems; chemical delivery systems; and wafer dryers. Its wet process technologies include TruEtch metal etching, SiEtch KOH etching, FluidJet metal lift-off, and advanced chemical etching for silicon carbide. Electroplating platforms can handle metals such as gold, silver, copper, and nickel, as well as alloys. Designed for precise process control, throughput, and efficient use of space, RENA’s solutions support cleaning, etching, stripping, plating, and drying operations.