Unclaimed brand
In late 2020, Sahasra group established a new company - Sahasra Semiconductors Pvt. Ltd. for flash memory & IC packaging that has been approved under the PLI & SPECS scheme of Govt. of India, Ministry of Electronics & IT. The plant has been commissioned and commercial operations commenced in March 2023. It is the first ATMP/OSAT plant for memory packaging in India however will also cater to other packages for OSAT customers namely QFN, DFN, SOIC, SOP, etc. Sahasra Semiconductors has been set up in Bhiwadi, Rajasthan as a state of the art green field project spread over 8000 sqmtrs of land with over 8000 sqmtrs of built up area. It currently houses 1 line that can produce 18 million chips a year however the plant has been built to accommodate 2 more lines that shall take up the annual capacity to 54 million chips a year. With Class 10k and Class 100k clean rooms spread over 5000 sqmtrs Sahasra has installed equipment necessary for processing 6”, 8” & 12” wafers from Front of the Line to End of the Line. Sahasra Semiconductors has also invested in design of certain packages and peripherals within the ecosystem untill tape out offering OSAT/ATMP solutions for its customers in the Semicon industry. These designs are being done within India such that Sahasra owns the IP and tooling.
Liking this brand profile? Share this page
Hex Code
Color name
RGB
HSL
CMYK
#8FAE3D
Sushi
143, 174, 61
76, 48, 46
18, 0, 65, 32
#FFFFFF
White
255, 255, 255
0, 0, 100
0, 0, 0, 0
#000000
Black
0, 0, 0
0, 0, 0
0, 0, 0, 100
Sahasra Semiconductors Pvt. Ltd. (SSPL) is a Sahasra Group company focused on semiconductor assembly, testing, marking and packaging in India. Based in Bhiwadi, Rajasthan, it operates an ATMP facility with clean rooms and began trial and sample production in March 2023. The company describes itself as India’s first private provider of NAND flash IC packaging and testing services. Its approvals include the central government’s PLI and SPECS schemes, as well as customized incentive support from the Rajasthan government.
SSPL’s offerings include chip-on-board (COB), MicroSD cards, embedded MultiMediaCard (eMMC) products and BGA packaging. These memory products and components serve applications in computers, mobile devices, tablets, servers, drones, industrial and automotive electronics, and Internet of Things products. The facility is equipped for processes including wafer back grinding, dicing, die bonding, laser marking and cutting, singulation, pick-and-place, and MicroSD testing.
As part of a group involved in USB drives, MicroSD cards and SSDs, SSPL represents Sahasra’s move toward greater domestic value addition in electronic storage manufacturing.
Company type
Privately Held
Year founded
2020
Company size
11-50 employees
