SEMPAC

SEMPAC is a privately owned semiconductor packaging company based in the Pacific Northwest’s Silicon Forest. It focuses on designing, developing, and manufacturing premolded open-cavity plastic packages, offering integrated packaging solutions for semiconductor applications. Its Open-Pak™ product range includes packages in QFN, QFP, SOIC, and SSOP product lines, with options across a variety of body sizes, lead counts, pitches, and thicknesses. The company also offers related components such as lids and sockets, along with part bundles.

SEMPAC says its packages are molded using green molding compounds, plated with Au/Ni for bondability, and designed to meet JEDEC outlines. Materials used in its manufacturing processes are RoHS- and REACH-compliant. The company’s engineers and management team bring experience in packaging, assembly, and materials, supporting customers’ needs in modern assembly environments. SEMPAC emphasizes lasting customer partnerships and an independent business model that allows it to collaborate with partners without competing against them. Through this focused approach, the company develops packaging products intended to help bring semiconductor solutions to market.