Syenta

Syenta is a semiconductor technology company developing advanced chip-to-chip interconnects to address the memory bandwidth bottlenecks facing artificial intelligence computing. Its proprietary Localized Electrochemical Manufacturing (LEM) process combines metal deposition and patterning in a single step, using a patterned stamp electrode to place metal precisely where needed. The resulting High-Resolution Interconnects are designed to enable dense, wafer-level integration of computing and memory components, extending beyond the limits of traditional packaging.

Syenta’s technology supports scaling in three directions: finer interconnect dimensions, larger package sizes, and higher-volume production. The company reports sub-micron interconnects, packages larger than 1,000 square millimetres, and throughput three times that of existing manufacturing technologies. Its product offering includes Achyon, a production tool for advanced packaging powered by LEM. Syenta also works with investors and industry partners and presents its technology at semiconductor events. Founded by specialists in localized electrodeposition, chemistry, physics, and manufacturing, the company is focused on commercialising a new approach to semiconductor packaging and enabling higher-bandwidth AI systems.